Initialize GPIO: // This example function is found in the F2837xD_Gpio.c file andCCS/LAUNCHXL-F28379D: Programs with the C2000Ware examples for F28379D Hainan Wang Intellectual 440 points Part Number: LAUNCHXL-F28379D Other Parts Discussed in Thread: C2000WARE Tool/software: Code Composer Studio Hi, there I am running an example project from C2000Ware for my Launchpad LAUNCHXL-F28379D.Other Parts Discussed in Thread: C2000WARE, LAUNCHXL-F28379D, TMS320F280049 请注意，本文内容源自机器翻译，可能存在语法或其它翻译错误，仅供参考。 如需获取 …This video is about setting up LaunchXL-F28379D in Code Composer Studio. Designers can download their models using our 3D Model Part Configurator.Cherry blossoms after winter mydramalist. In the Samtec 3D Models library, many types of 2D and 3D models including AutoCad, Solid Edge, Inventor and 3D Studio Max are available for each series free of charge. Launched in 2013, SnapEDA is funded by Y Combinator and private investors. For added productivity, designers can leverage InstaBuild, our computer-vision library creators, and InstaPart, their 24-hour request service. Ready-to-use building blocks can be downloaded from their website or plugins. They help over half a million hardware designers build products faster each year. SnapEDA is the Internet’s first & leading electronics design library. Case Study Details Samtec’s Downloadable 3D Models.
Our friends at SnapEDA tell us that Samtec is one of the most in-demand connector manufacturers and they feel designers will benefit greatly from these new PCB libraries. Using SnapEDA’s library translator, the files can also be downloaded for Altium, KiCad, PCB123, Proteus 8.8, and Pulsonix. Samtec has made the files available for OrCad, Allegro, Eagle and PADS. The footprints employ courtyards, built-in dimensioning, and applicable metadata.ĭownloading the printed circuit board (PCB) models is simple: designers create a free account on the SnapEDA website, and then they can download for free.
Created by Samtec’s Signal Integrity Team, these detailed, high-quality models include accurate assembly, silkscreen and 3D features to support high density applications.
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